VT-610 PCBA DESOLDERING REWORK SYSTEM

⭐ 1. Safe & Efficient Component Removal
Designed for precise desoldering of large and complex PCBA assemblies while minimizing thermal stress and PCB damage.

⚡ 2. Advanced Heating Control Technology
Multi-zone heating system provides accurate and uniform temperature distribution, ensuring stable and reliable desoldering performance.

🔧 3. Higher Recovery Rate & Reduced Scrap
Improves component recovery and repair success rates, reducing material waste and lowering overall production costs.

VT-128 PTH REWORK SYSTEM

⭐ 1. Precise Through-Hole Component Rework
Designed for accurate removal and replacement of PTH (Pin Through Hole) components while protecting PCB integrity and surrounding parts.

⚡ 2. Advanced Heating & Solder Extraction Technology
Provides controlled heating and efficient solder removal, ensuring clean rework results and minimizing the risk of pad damage.

🔧 3. Improved Repair Quality & Productivity
Enhances rework consistency, reduces repair time, and increases production efficiency for high-reliability electronics manufacturing.

VT-300XII HOT AIR DESOLDERING SYSTEM

⭐ 1. Fast & Precise Hot Air Desoldering
Advanced hot air technology enables accurate and efficient component removal while minimizing thermal impact on surrounding areas.

⚡ 2. Uniform Heating for Reliable Rework
Optimized airflow and temperature control ensure consistent heat distribution, reducing the risk of PCB damage and rework defects.

🔧 3. Improved Productivity & Process Stability
Designed for high-efficiency rework operations, helping manufacturers reduce repair time, increase yield, and maintain stable production quality.

VT-660L BGA DESOLDERING REWORK SYSTEM

⭐ 1. High-Precision BGA Desoldering Technology
Advanced alignment and heating control enable accurate BGA removal while minimizing PCB warpage and component damage.

⚡ 2. Uniform Multi-Zone Heating System
Top and bottom heating zones provide consistent temperature distribution, ensuring safe and reliable desoldering performance.

🔧 3. Increased Recovery Rate & Lower Rework Cost
Improves component recovery success, reduces material waste, and enhances overall rework efficiency for high-value PCB assemblies.

VT-760M BGA PRINTING PRESS

⭐ 1. High-Precision BGA Solder Paste Printing
Designed for accurate solder paste application on BGA components, ensuring consistent paste volume and improved assembly quality.

⚡ 2. Stable Alignment & Printing Performance
Advanced positioning system provides precise stencil alignment, reducing printing defects and enhancing process consistency.

🔧 3. Improved Yield & Rework Efficiency
Optimized for BGA reballing and rework applications, helping increase repair success rates and reduce material waste.

VT-860L BGA BALL PLACEMENT SYSTEM

⭐ 1. High-Accuracy BGA Ball Placement
Advanced placement technology ensures precise and consistent positioning of solder balls, improving reballing quality and process reliability.

⚡ 2. Fast & Automated Operation
Automated ball placement system increases productivity, reduces manual handling, and minimizes operator-dependent errors.

🔧 3. Enhanced Yield & Rework Efficiency
Delivers uniform ball placement for higher rework success rates, reduced material waste, and improved manufacturing performance.

VT-960MN BGA LEAD FREE REFLOW OVEN

⭐ 1. Optimized Lead-Free Reflow Performance
Designed specifically for lead-free soldering processes, ensuring high-quality solder joints and reliable assembly results.

⚡ 2. Excellent Thermal Uniformity & Process Stability
Advanced heating and airflow management deliver consistent temperature distribution, reducing defects and improving product quality.

🔧 3. Energy-Efficient & High-Throughput Production
Smart control systems help reduce energy consumption while maintaining stable, efficient, and high-volume manufacturing performance.